Yanling (Shanghai) Technology Co., LTD

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Process parameter

Number of floors

2-64 L

Plate thickness

0.5-17.5mm

Finished copper thickness

0.3-12oz

Minimum mechanical aperture

0.1mm

Minimum laser aperture

0.075mm

HDI type

1+n+1、2+n+2、3+n+3

Maximum plate thickness aperture ratio

20:1

Maximum board size

650mm X 1130mm

Minimum line width & spacing

2.4/2.4mil

Minimum contour tolerance

±0.1mm

Minimum impedance tolerance

±5%

Minimum insulation thickness

0.06mm

Warping degree

≤0.5%

board

FR4/Hi-Tg FR4/Rogers/Nelco/RCC/

PTFE/M4/M6/TU862/TU872

Surface treatment

Tinspray HASL, lead-free tinspray HASL PB FREE，Sunk gold, sunk tin, sunk silver, gold-plated, OSP, sunk gold +OSP

Special processing

Buried blind hole, step slot, metal substrate, buried resistance and buried capacity,

Mixed pressure, soft and hard combination, back drill, gold finger

Number of floors

batch

template

urgent

two-sided

9Days

5Days

48Hour

four-layer

10Days

5Days

3Days

Six layers

12Days

6Days

3Days

Eight layers

12Days

7Days

4Days

Ten floors

14Days

10Days

4Days

Twelve floors

14Days

10Days

5Days

Fourteen floors

16Days

12Days

6Days

Sixteen floors

16Days

12Days

6Days

Eighteen floors

18Days

14Days

6Days

Twentieth floor

18Days

14Days

8Days

Twenty-two stories

20Days

14Days

8Days

Twenty-fourth floor

20Days

14Days

8Days

Twenty-sixth floor

20Days

14Days

10Days

Twenty-eighth floor

20Days

14Days

10Days