item |
Process parameter |
Number of floors |
2-64 L |
Plate thickness |
0.5-17.5mm |
Finished copper thickness |
0.3-12oz |
Minimum mechanical aperture |
0.1mm |
Minimum laser aperture |
0.075mm |
HDI type |
1+n+1、2+n+2、3+n+3 |
Maximum plate thickness aperture ratio |
20:1 |
Maximum board size |
650mm X 1130mm |
Minimum line width & spacing |
2.4/2.4mil |
Minimum contour tolerance |
±0.1mm |
Minimum impedance tolerance |
±5% |
Minimum insulation thickness |
0.06mm |
Warping degree |
≤0.5% |
board |
FR4/Hi-Tg FR4/Rogers/Nelco/RCC/ PTFE/M4/M6/TU862/TU872 |
Surface treatment |
Tinspray HASL, lead-free tinspray HASL PB FREE,Sunk gold, sunk tin, sunk silver, gold-plated, OSP, sunk gold +OSP |
Special processing |
Buried blind hole, step slot, metal substrate, buried resistance and buried capacity, Mixed pressure, soft and hard combination, back drill, gold finger |
Number of floors |
batch |
template |
urgent |
two-sided |
9Days |
5Days |
48Hour |
four-layer |
10Days |
5Days |
3Days |
Six layers |
12Days |
6Days |
3Days |
Eight layers |
12Days |
7Days |
4Days |
Ten floors |
14Days |
10Days |
4Days |
Twelve floors |
14Days |
10Days |
5Days |
Fourteen floors |
16Days |
12Days |
6Days |
Sixteen floors |
16Days |
12Days |
6Days |
Eighteen floors |
18Days |
14Days |
6Days |
Twentieth floor |
18Days |
14Days |
8Days |
Twenty-two stories |
20Days |
14Days |
8Days |
Twenty-fourth floor |
20Days |
14Days |
8Days |
Twenty-sixth floor |
20Days |
14Days |
10Days |
Twenty-eighth floor |
20Days |
14Days |
10Days |
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